November 13, 2025
Breaking Barriers: Taiyo Holdings’ Innovative Leap in Semiconductor Packaging
The world of semiconductor technology is ever-evolving, with breakthroughs continually advancing the capabilities of processors and devices. Recently, Taiyo Holdings made headlines by unveiling its latest innovation—the FPIM (TM) Series, a next-generation semiconductor-packaging material. This development, spotlighted at the 14th IEEE CPMT Symposium in Japan, represents a significant leap in manufacturing efficiency and precision. Central […]